8 amplifiers - smt 8 - 1 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com discontinued product not recommended for new designs hmc314 gaas ingap hbt mmic driver amplifier, 0.7 - 4.0 ghz v02.0802 general description features functional diagram the hmc314 is a gaas ingap heterojunction bipolar transistor (hbt) mmic amplifi er that oper- ates from a single positive supply. this amplifi er also incorporates a power down feature. when the vpd pin is held low, the amplifi er will shut down. the surface mount sot26 amplifi er can be used as a broadband gain stage for wideband applications. the amplifi er provides 12 db of gain and +22 dbm of saturated power while operating from a single positive +5v supply. the hmc314 is packaged in an ultra small sot26 package at a height of only 1.45mm. p1db output power: +18 dbm output ip3: +29 dbm gain: 12 db single supply: 5v ultra small package: sot26 electrical specifi cations, t a = +25 c typical applications ideal broadband gain stage for: ? 2.2 - 2.7 ghz mmds ? 3.5 ghz wireless local loop ? low profi le portable wireless devices ? wlan systems parameter vs = +5v, rbias = 10 ohm units min. typ. max. frequency range 0.7 - 4.0 ghz gain 71216db gain variation over temperature 0.015 0.025 db/c input return loss 612 db output return loss 2 6 db reverse isolation 22 30 db output power for 1 db compression (p1db) @ 1 ghz 15 18 dbm saturated output power (psat) @ 1 ghz 19 22 dbm output third order intercept (ip3) @ 1 ghz 26 29 dbm switching speed on/off 60 ns supply current (icc) 150 ma control voltage (vpd) 0/5 volts control current (ipd) .001/12 ma
8 amplifiers - smt 8 - 2 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com discontinued product not recommended for new designs hmc314 output return loss vs. temperature gain & return loss gain vs. temperature reverse isolation vs. temperature input return loss vs. temperature gaas ingap hbt mmic driver amplifier, 0.7 - 4.0 ghz v02.0802 -25 -20 -15 -10 -5 0 5 10 15 20 01234567 s11 s21 s22 response (db) frequency (ghz) -20 -16 -12 -8 -4 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 + 25 c + 65 c - 40 c return loss (db) frequency (ghz) -25 -20 -15 -10 -5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 + 25 c + 65 c - 40 c return loss (db) frequency (ghz) -50 -40 -30 -20 -10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 + 25 c + 65 c - 40 c isolation (db) frequency (ghz) 0 5 10 15 20 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 + 25 c + 65 c - 40 c gain (db) frequency (ghz)
8 amplifiers - smt 8 - 3 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com discontinued product not recommended for new designs power compression @ 3 ghz p1db vs. temperature psat vs. temperature output ip3 vs. temperature power compression @ 1 ghz hmc314 gaas ingap hbt mmic driver amplifier, 0.7 - 4.0 ghz v02.0802 0 5 10 15 20 25 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 + 25 c + 65 c - 40 c p1db (dbm) frequency (ghz) -5 0 5 10 15 20 25 -8-6-4-20246810121416 pout (dbm) gain (db) pae (%) pout (dbm), gain (db), pae (%) input power (dbm) -5 0 5 10 15 20 25 -8-6-4-20246810121416 pout (dbm) gain (db) pae (%) pout (dbm), gain (db), pae (%) input power (dbm) 0 5 10 15 20 25 30 35 40 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 + 25 c + 65 c - 40 c ip3 (dbm) frequency (ghz) 0 5 10 15 20 25 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 + 25 c + 65 c - 40 c psat (dbm) frequency (ghz)
8 amplifiers - smt 8 - 4 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com discontinued product not recommended for new designs outline drawing absolute maximum ratings truth table notes: 1. package body material: low stress injection molded plastic silica and silicon impregnated. 2. leadframe material: copper alloy 3. leadframe plating: sn/pb solder 4. dimensions are in inches [millimeters]. 5. dimension does not include moldflash of 0.15mm per side. 6. dimension does not include moldflash of 0.25mm per side. 7. all ground leads must be soldered to pcb rf ground. 8. classified as moisture sensitivity level (msl) 1. vs vctl is ictl state 5v 5v 150 ma 12 ma on 5v 0v <1 a <1 a power down collector bias voltage (vcc) +5.0 vdc control voltage range (vpd) -0.2 to 3.5 vdc rf input power (rfin)(vs = +5.0 vdc) +20 dbm junction temperature 150 c continuous pdiss (t = 65 c) (derate 6.57 mw/ c above 65 c) 0.558 w thermal resistance (junction to lead) 152 c/w storage temperature -65 to +150 c operating temperature -40 to +65 c % , % # 4 2 / 3 4 ! 4 ) # 3 % . 3 ) 4 ) 6 % $ % 6 ) # % / " 3 % 2 6 % ( ! . $ , ) . ' 0 2 % # ! 5 4 ) / . 3 hmc314 gaas ingap hbt mmic driver amplifier, 0.7 - 4.0 ghz v02.0802
8 amplifiers - smt 8 - 5 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com discontinued product not recommended for new designs application circuit note: 1. requires a 10 ohm resistor (rbias) in series with the vcc line and a 160 ohm resistor in series with the vpd line. 2. requires blocking capacitors on pins 1 & 3. 3. requires bypass capacitors on vcc and vpd line as shown. hmc314 gaas ingap hbt mmic driver amplifier, 0.7 - 4.0 ghz v02.0802
8 amplifiers - smt 8 - 6 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com discontinued product not recommended for new designs the circuit board used in the fi nal application should use rf circuit design techniques. signal lines should have 50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. a sufficient number of via holes should be used to connect the top and bottom ground planes. the evaluation circuit board shown is available from hittite upon request. evaluation pcb list of material item description j1, j2 pc mount sma connector j3, j4, j5 dc pins u1 hmc314 pcb* 104198 evaluation pcb 1.5 x 1.5 *circuit board material: roger 4350 hmc314 gaas ingap hbt mmic driver amplifier, 0.7 - 4.0 ghz v02.0802
|
